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For brush motors
Reversible motor drivers (up to 2A series)
BA6219BFP-Y, BA6222
Overview These motor drivers are full bridge drivers for brush motor applications, supporting output currents of up to 2A. The output modes are available in four modes, normal, reverse, stop (idling), and braking in accordance with input logic (2 inputs). The output voltage can be optionally set by reference voltage setting pin.
No.09008EAT03
Features 1) Large output current (lOMAX=2.2A) 2) Built-in thermal shutdown circuit 3) Output voltage can be optionally set by reference voltage setting pin 4) High output voltage can be set by low voltage input because of it has 11.4dB gain (BA6222) 5) Low standby current
Applications Audio-visual equipment; PC peripherals; Car audios; Car navigation systems; OA equipments
Absolute maximum ratings (Ta=25C, All voltages are with respect to ground) Parameter Supply voltage Output current All other input pins Operating temperature Storage temperature Power dissipation Junction temperature Symbol VCC1, VCC2 IOMAX VIN TOPR TSTG Pd Tjmax -55 ~ 150 1.45* 150
2
Ratings BA6219BFP-Y 24 2.2* -0.3 ~ VCC1
1
BA6222
Unit V A
-0.3 ~ VCC1+0.3 -25 ~ 75 -55 ~ 125 2.00* 125
3
V C C W C
*1 Do not, exceed Pd or ASO (Pulse at 1/100 duty: 500s). *2 HSOP25 package. Mounted on a 70mm x 70mm x 1.6mm FR4 glass-epoxy board with less than 3% copper foil. Derated at 11.6mW/C above 25C. *3 HSIP10 package. Derated at 20mW/C above 25C.
Operating conditions (Ta=25C) Parameter Supply voltage Symbol VCC1, VCC2 Ratings 8 ~ 18 Unit V
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1/10
2009.04 - Rev.A
BA6219BFP-Y, BA6222
Electrical characteristics (BA6219BFP-Y, unless otherwise specified, Ta=25C and VCC1=VCC2=12V) Parameter Supply current 1 Supply current 2 Supply current 3 Input threshold voltage H Input threshold voltage L VR bias current CD1 current CD2 current Output leak current Output voltage H Output voltage L Symbol ICC1 ICC2 ICC3 VIH VIL IVREF ICD1 ICD2 IOL VOH VOL Limits Min. 3.0 0 0.6 0.7 0.7 6.5 Typ. 1.2 16 25 1.2 1.5 1.5 Max. 2.5 35 60 VCC1 1.0 2.4 3.0 3.0 1 1.2 Unit mA mA mA V V mA mA mA mA V V RL=60, VR=6.8V
Technical Note
Conditions Standby mode FWD/REV mode Brake mode
(IN1, IN2)=(H, L), CD1 -> GND (IN1, IN2)=(L, H), CD2 -> GND (IN1, IN2)=(L, L), VCC2 current RL=60, VR=6.8V RL=60, VR=6.8V
Electrical characteristics (BA6222, unless otherwise specified, Ta=25C and VCC1=VCC2=12V) Parameter Supply current 1 Supply current 2 Supply current 3 Input threshold voltage H Input threshold voltage L VR bias current VR-OUT trans. gain CD1 current CD2 current Output leak current Output voltage H Output voltage L Symbol ICC1 ICC2 ICC3 VIH VIL IVREF GV ICD1 ICD2 IOL VOH VOL Limits Min. 3.0 0 10.35 0.7 0.7 9.5 Typ. 1.2 16 25 1.2 11.35 1.5 1.5 Max. 2.5 35 60 VCC1 1.0 5.0 12.35 3.0 3.0 1 0.5
GV = 20 log
Unit mA mA mA V V A dB mA mA mA V V VR=1.0V
Conditions Standby mode, VR=0V FWD/REV mode, VR=0V Brake mode, VR=0V
(IN1, IN2)=(H, L) or (L, H), IOUT=0.1A*1 (IN1, IN2)=(H, L), CD1 -> GND (IN1, IN2)=(L, H), CD2 -> GND (IN1, IN2)=(L, L), VCC2 current IOUT=0.1A, VR=5V IOUT=0.1A, VR=5V
*1 Vout1 = VOH-VOL @VR=1V Vout2 = VOH-VOL @VR=2V These voltages are stabilized value without any heat radiation board.
Vout2 - Vout1 2V - 1V
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2009.04 - Rev.A
BA6219BFP-Y, BA6222
Electrical characteristic curves (Reference data)
2.0 -25C 25C 75C 1.5 25 -25C 25C 75C 20 40
Technical Note
Stand-by Current: Icc2 [mA]_
Circuit Current: Icc1 [mA] _
Supply Current: Icc3 [mA]_
30
1.0
15
20
-25C 25C 75C
0.5 8 10 12 14 16 18 Supply Voltage: Vcc [V]
10 8 10 12 14 16 18 Supply Voltage: Vcc [V]
10 8 10 12 14 16 18 Supply Voltage: Vcc [V]
Fig.1 Supply current 1 (standby) (BA6219BFP-Y)
2.0 -25C 25C 75C 1.5 25
Fig.2 Supply current 2 (reverse) (BA6219BFP-Y)
40 -25C 25C 75C 20
Fig.3 Supply current 3 (brake) (BA6219BFP-Y)
Stand-by Current: Icc2 [mA]_
Circuit Current: Icc1 [mA] _
Supply Current: Icc3 [mA]_
30
1.0
15
20
-25C 25C 75C
0.5 8 10 12 14 16 18 Supply Voltage: Vcc [V]
10 8 10 12 14 16 18 Supply Voltage: Vcc [V]
10 8 10 12 14 16 18 Supply Voltage: Vcc [V]
Fig.4 Supply current 1 (standby) (BA6222)
8.0 Output High Voltage: VOH [V] _ 75C 25C -25C
Fig.5 Supply current 2 (reverse) (BA6222)
11.0 Output High Voltage: VOH [V] _ 75C 25C -25C 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 0.5 1 1.5 2
Fig.6 Supply current 3 (brake) (BA6222)
7.5
10.5
7.0
10.0
6.5
-25C 25C 75C 0 0.5 1 1.5 2
9.5
Output Low Voltage: VOL [V] _
6.0 Output Current: Iout [A]
9.0 Output Current: Iout [A]
75C 25C -25C 0 0.5 1 1.5 2
Output Current: Iout [A]
Fig.7 Output high voltage (BA6219BFP-Y)
3.0 2.5 2.0
Fig.8 Output high voltage (BA6222)
3
ii) Mounted on ROHM standard PCB
Fig.9 Output low voltage (BA6219BFP-Y)
3
i) Without heat sink i) 2.0W
Output Low Voltage: VOL [V] _
(70mm x 70mm x 1.6mm FR4 glas s-epox y board)
i) Package only
2 Pd [W]
ii)1.45W
2 Pd [W] 1
i)0.85W
1.5 1.0 0.5 0.0 0 0.5 1 1.5 Output Current: Iout [A] 75C 25C -25C 2
1
0 0 25 50 75 100 125 150 AMBIENT TEMPERATURE [C]
0 0 25 50 75 100 125 150 AMBIENT TEMPERATURE [C]
Fig.10 Output low voltage (BA6222)
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Fig.11 Thermal derating curve (HSOP25)
Fig.12 Thermal derating curve (HSIP10)
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2009.04 - Rev.A
BA6219BFP-Y, BA6222
Block diagram and pin configuration BA6219BFP-Y
10 TSD IN1 6 CTRL IN2 8 15 19 20 FIN GND 7 VR 4 CD2 13 C3 ZD 2 CD1 C2 GND GND 11 24 OUT1 M C4 VCC1 VCC2 R1 C1
Technical Note
Table 1 BA6219BFP-Y Pin 2 4 6 7 8 10 11 13 15 19 20 24 FIN Name CD1 VR IN1 GND IN2 VCC1 VCC2 CD2 OUT2 GND GND OUT1 GND Function Cross conduction control pin Reference voltage setting pin Control input (forward) GND Control input (reverse) Power supply (small signal) Power supply (driver stage) Cross conduction control pin Driver output GND GND Driver output GND
OUT2
Fig.13 BA6219BFP-Y
NC CD1 NC VR NC IN1 GND GND IN2 NC VCC1 VCC2 NC CD2
NC OUT1 NC NC NC GND GND GND NC NC NC OUT2 NC
Note: All pins not described above are NC pins.
Fig.14 HSOP25
BA6222
7 TSD IN1 5 CTRL IN2 6 x4 10 1 OUT2 GND x4 8 2 VCC1 VCC2 OUT1 M C4 R1 C1
Table 2 BA6222 Pin 1 2 3 4 5 6 7 8 9 10 FIN Name GND OUT1 CD1 VR IN1 IN2 VCC1 VCC2 CD2 OUT2 GND GND Driver output Cross conduction control pin Reference voltage setting pin Control input (forward) Control input (reverse) Power supply (small signal) Power supply (driver stage) Cross conduction control pin Driver output GND Function
FIN C5
VR
4
CD2
9 C3
3
CD1 C2
ZD
Fig.15 BA6222
GND
VR
IN1
OUT1
IN2
Fig.16 HSIP10
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OUT2
CD1
VCC1
VCC2
CD2
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2009.04 - Rev.A
BA6219BFP-Y, BA6222
External application components
Technical Note
1) Resistor for the current limitation, R1 This is a current limiting resistor for collector loss reduction and at the time of short-circuited output. It depends on the power supply voltage used, etc., but choose resistance of about 5 to 10. In addition, set resistance with utmost care to voltage drop caused by inrush current that flows when the motor is started. 2) Zener diode for the output high voltage setting, ZD This is the zener diode used when output high voltage (VR pin voltage) is set. BA6219BFP-Y: Output high voltage zener voltage BA6222: Output high voltage fourfold zener voltage 3) Stabilization capacitor for the power supply line, C1 Please connect the capacitor of 1F to 100F for the stabilization of the power supply line, and confirm the motor operation. 4) Capacitors for the cross conduction control of output transistors, C2 and C3 Simultaneous ON is prevented by delaying base potential buildup of transistors which enter output high state. Set the capacitors from 0.01F to 1F and make sure inrush current caused by simultaneous output ON does not flow when output mode is switched. 5) Phase compensating capacitor, C4 Noise is generated in output pins or oscillation results in accord with the set mounting state such as power supply circuit, motor characteristics, PCB pattern artwork, etc. As noise oscillation measures, connect 0.01F to 0.1F capacitors. 6) Phase compensating capacitor, C5 (BA6222 only) The gain about fourfold VR pin voltage in output high voltage is set, and the output oscillates easily. Please connect the capacitor of 3300pF to 0.1F as an oscillation prevention measures when the oscillation is seen in the output voltage.
Functional descriptions 1) Operation modes Table 3 Logic table IN1 L H L H IN2 L L H H OUT1 OPEN* H L L OUT2 OPEN* L H L Operation Stop (idling) Forward (OUT1 > OUT2) Reverse (OUT1 < OUT2) Brake (stop)
* OPEN is the off state of all output transistors. Please note that this is the state of the connected diodes, which differs from that of the mechanical relay.
a) Stand-by mode In stand-by mode, all output power transistors are turned off, and the motor output goes to high impedance. b) Forward mode This operating mode is defined as the forward rotation of the motor when the OUT1 pin is high and OUT2 pin is low. When the motor is connected between the OUT1 and OUT2 pins, the current flows from OUT1 to OUT2. c) Reverse mode This operating mode is defined as the reverse rotation of the motor when the OUT1 pin is low and OUT2 pin is high. When the motor is connected between the OUT1 and OUT2 pins, the current flows from OUT2 to OUT1. d) Brake mode This operating mode is used to quickly stop the motor (short circuit brake).
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2009.04 - Rev.A
BA6219BFP-Y, BA6222
Technical Note
2) Output high voltage setting This function optionally sets output voltage by the output high voltage setting pin and controls the motor rotating speed. However, when the output high voltage is set to a low level, consumption at IC increases. Carry out thermal design with sufficient margin incorporated with the power dissipation (Pd) under the actual application condition taken into account. a) BA6219BFP-Y The circuit diagram associated with the output high voltage setting VR pin is as per shown on the right. The maximum output voltage VOMAX is expressed by: VOMAX = VCC1 - ( VSAT(Q1) + VF(Q2) + VF(Q3) + VF(Q4) ) In addition, the relation of VR voltage to output voltage at VOMAX or lower is expressed by: VOH = VR + ( VF(Q5) + VF(Q6) + VF(Q7) ) - ( VF(Q2) + VF(Q3) + VF(Q4) ) VOH = VR + VF VR
Q5 Q6 Q7 OUT VR
VCC1 Q1 Q2 Q3 Q4
VCC2
Fig. 17
VF depends on the output current but is nearly VOH=VR. (Reference values; VSAT 0.25V, VF 0.75V) b) BA6222 As the relationship between the output high voltage setting pin VR voltage and output high voltage VOH is expressed by: VOH 4 x VR + VOFS In such event, VOFS means the offset voltage, which varies in accord with output current and chip temperature. The VR voltage region can be classified into three categories in accord with the output state: (A) Output high voltage 0V offset region (B) Fourfold gain region (C) Output voltage saturated region
VOH
VCC1 - 3VF - VSAT
BA6222 BA6219BFP-Y
(A)
(B)
(C)
VR
Fig. 18
Using this function with the VR pin connected to a load which has output impedance of several hundreds ohm may result in oscillation. In such event, connect a capacitor of 3300pF or higher to about 0.1F across VR and GND and make sure that the motor is free of oscillation. c) Power supply voltage range of VR voltage When output voltage control pin (VR) is used: VR < VCC1 - ( VSAT(Q1) + VF(Q5) + VF(Q6) + VF(Q7) ) VR VCC1 - 2.5V VR < VCC2 - ( VSAT(Q3) - VF(Q3) - VF(Q2) ) - ( VF(Q5) + VF(Q6) + VF(Q7) ) VR VCC2 - 1V The output voltage control function does not operate in the region outside this range. In addition, when the VR pin is not used, use by shorting VR to VCC1.
VR
VOH
Control range
Saturation range
Fig. 19
3) Switching of rotating direction (FWD/REV) When the rotating direction is changed over by the motor rotating condition, switch the direction after the motor is temporarily brought to the BRAKE condition or OPEN condition. It is recommended to keep the relevant conditions as follows: via BRAKE: Longer than braking time*.
(* the time required for the output L terminal to achieve potential below GND when brake is activated.)
via OPEN: The time longer than 1 ms is recommended.
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2009.04 - Rev.A
BA6219BFP-Y, BA6222
Interfaces
Technical Note
IN1 IN2
20k 10k VR 10k 10k
Fig. 20 IN1, IN2 (BA6219BFP-Y, BA6222)
Fig.21 VR (BA6222)
VCC2 VCC1
CD1
CD2
OUT1
OUT2
VR
GND
Fig. 22 VCC1, VCC2, VR, CD1, CD2, GND (BA6219BFP-Y)
VCC2 VCC1 CD1 CD2
OUT1
OUT2
GND
Fig. 23 VCC1, VCC2, CD1, CD2, GND (BA6222)
Notes for use 1) Absolute maximum ratings Devices may be destroyed when supply voltage or operating temperature exceeds the absolute maximum rating. Because the cause of this damage cannot be identified as, for example, a short circuit or an open circuit, it is important to consider circuit protection measures - such as adding fuses - if any value in excess of absolute maximum ratings is to be implemented. 2) Connecting the power supply connector backward Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply lines, such as adding an external direction diode.
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2009.04 - Rev.A
BA6219BFP-Y, BA6222
Technical Note
3) Power supply lines Return current generated by the motor's Back-EMF requires countermeasures, such as providing a return current path by inserting capacitors across the power supply and GND (10F, ceramic capacitor is recommended). In this case, it is important to conclusively confirm that none of the negative effects sometimes seen with electrolytic capacitors - including a capacitance drop at low temperatures - occurs. Also, the connected power supply must have sufficient current absorbing capability. Otherwise, the regenerated current will increase voltage on the power supply line, which may in turn cause problems with the product, including peripheral circuits exceeding the absolute maximum rating. To help protect against damage or degradation, physical safety measures should be taken, such as providing a voltage clamping diode across the power supply and GND. 4) Electrical potential at GND Keep the GND terminal potential to the minimum potential under any operating condition. In addition, check to determine whether there is any terminal that provides voltage below GND, including the voltage during transient phenomena. When both a small signal GND and high current GND are present, single-point grounding (at the set's reference point) is recommended, in order to separate the small signal and high current GND, and to ensure that voltage changes due to the wiring resistance and high current do not affect the voltage at the small signal GND. In the same way, care must be taken to avoid changes in the GND wire pattern in any external connected component. 5) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) under actual operating conditions. 6) Inter-pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error, or if pins are shorted together. 7) Operation in strong electromagnetic fields Using this product in strong electromagnetic fields may cause IC malfunctions. Use extreme caution with electromagnetic fields. 8) ASO - Area of Safety Operation When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO. 9) Built-in thermal shutdown (TSD) circuit The TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation in the presence of extreme heat. Do not continue to use the IC after the TSD circuit is activated, and do not operate the IC in an environment where activation of the circuit is assumed. BA6219BFP-Y TON [C] THYS [C]
*All temperature values are typical.
BA6222 150 15
180 15
10) Capacitor between output and GND In the event a large capacitor is connected between the output and GND, if VCC and VIN are short-circuited with 0V or GND for any reason, the current charged in the capacitor flows into the output and may destroy the IC. Use a capacitor smaller than 1F between output and GND. 11) Testing on application boards When testing the IC on an application board, connecting a capacitor to a low impedance pin subjects the IC to stress. Therefore, always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to or removing it from the test setup during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when transporting or storing the IC.
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8/10
2009.04 - Rev.A
BA6219BFP-Y, BA6222
Technical Note
12) Regarding the input pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements, in order to keep them isolated. P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode or transistor. For example, the relation between each potential is as follows: When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, as well as operating malfunctions and physical damage. Therefore, do not use methods by which parasitic diodes operate, such as applying a voltage lower than the GND (P substrate) voltage to an input pin.
Pin A Resistor Pin A
P+ N P P+
Pin B
C
B E
Transistor (NPN)
Pin B
N
N
Parasitic element
N
P+
N P P+ N
B
C E
P substrate Parasitic element
GND
P substrate Parasitic element
GND GND GND
Parasitic element
Other adjacent elements
Appendix: Example of monolithic IC structure
Ordering part number
B
A
6
Type 6219B 6222
2
1
9
B
F
P
-
Y
-
E
2
ROHM part number
Package FP-Y: HSOP25 None: HSIP10
Packaging spec. E2: Embossed taping None: Container tube
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9/10
2009.04 - Rev.A
BA6219BFP-Y, BA6222
HSOP25
Tape
13.6 0.2
25
Technical Note
Embossed carrier tape 2000pcs E2
(Holding the reel with the left hand and pulling the tape out with the right, pin 1 will be on the upper left-hand side.)
Quantity
14
2.75 0.1
7.8 0.3
5.4 0.2
1
1.95 0.1 0.8
13
0.25 0.1
1.9 0.1
0.11
0.1 0.36 0.1
0.3Min.
Direction of feed
1234
(Unit:mm) HSIP10
26.5 0.3 25 0.2
Reel

Container
3.6 0.2
Tube 500pcs Direction of products is fixed in a container tube.
1234
1234
1Pin
*Orders should be placed in multiples of package quantity.
1234
1234
Direction of feed
1234
1234
Quantity Direction of feed
R1.6
27.0 0.5
16.2 0.2
1.2
6.4 0.5
1 2.54 0.6 0.8 1.3
10
8.4 0.3
1.6
0.5 0.1
(Unit:mm)
*Orders should be placed in multiples of package quantity.
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2009.04 - Rev.A
Notice
Notes
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